Materials Science 101
03 Mechanical Behavior
Chapter 07

Dislocations & Strengthening Mechanisms

Edge & screw motion under shear · slip systems in cubic crystals · the four routes to make a metal harder

Slip system — FCC {111}⟨110⟩

A slip system is a slip plane combined with a slip direction inside that plane. Dislocations preferentially glide on planes of highest atomic density (smallest b / largest planar spacing) along directions of shortest b.

Why these planes?

The close-packed plane of each structure is preferred because slipping along its close-packed direction requires the smallest atomic rearrangement, lowering the Peierls stress (the lattice resistance to dislocation motion).

τP ∝ exp( −2π · wb )

where w is the dislocation width (proportional to planar spacing). Wider planes ⇒ wider w ⇒ lower τP.

StructurePlaneDirectionSystems
SC{100}⟨100⟩3
BCC{110}, {112}, {123}⟨111⟩48
FCC{111}⟨110⟩12
HCP(0001)⟨11-20⟩3

Solid-solution strengthening

Foreign atoms (solutes) distort the host lattice and impose a strain field. A passing dislocation must either push through that strain field or bow around it — both cost extra stress. Substitutional solutes (different size on a lattice site) and interstitial solutes (C, N in Fe) both work; interstitials are usually 10–100× more potent per atom.

Δσss ≈ G · ε3/2 · c

where G is shear modulus, ε is the misfit strain per solute, and c is concentration. The c dependence comes from random spacing between solutes scaling as 1/c.

Δσss contribution (Cu–Ni alloy, G=46 GPa, ε≈0.04)

Examples

AlloySoluteTypeΔσ at 5 at%
Cu–NiNi in Cusubstitutional~25 MPa
Cu–Zn (brass)Zn in Cusubstitutional~60 MPa
Fe–CC in α-Feinterstitial~300 MPa

Cold work — strain hardening

Plastic deformation at room temperature multiplies dislocations (sources like Frank–Read operate as soon as τ rises). The new dislocations interact with one another, forming forests and tangles that pin further glide. As %CW rises, the metal becomes stronger but less ductile.

%CW = A0 − AdA0 × 100
τ ≈ τ0 + α · G · b · ρ

where ρ is the dislocation density (length / volume). Cold work raises ρ from ~1010 m−2 (annealed) to ~1015 m−2 (heavily worked).

Yield stress & ductility (annealed Cu baseline)

Stress–strain trace

Pull a sample to ε1, unload (elastic recovery), then reload: yielding now occurs at the previous flow stress, not the original σy. The "memory" of prior straining is stored in the dislocation network.